Tag Archives: PCB

Reflow hooray!


With a few dozen boards to be manufactured and given the limited time frame, I decided to try my luck with an own reflow oven. I went for PCB-Pool‘s approach that combines their PCB and stencil production services with a set of reflow tools for you to do the rest, i.e. baking the boards.

Applying the solder paste thru the stencil went really smooth and fast, while placing the components still took quite some time (but that was to be expected). The reflow itself was done in a few minutes and largely succesful, with just a few shorts across some pins of the one TSSOP chip with its 0.5mm pitch.

Looking forward to do more of this!